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Signal Integrity Issues and Printed Circuit Board Design by Douglas Brooks

Signal Integrity Issues and Printed Circuit Board Design Douglas Brooks ebook
Publisher: Prentice Hall International
ISBN: 013141884X, 9780131418844
Format: djvu
Page: 409

As a world-class semiconductor company, Fujitsu Semiconductor needed to address timing issues at three levels: LSI, PKG, and PCB, especially with the rapidly emerging DDR2/3/4 and SERDES interconnect standards. Cadence recently acquired FPGA/PCB "co-design" technology that automates and optimizes pin assignments, and PCB signal-integrity software is widely available. At these high transmission rates, signal integrity issues become increasingly restrictive on PCB trace and cable lengths, and on design implementation and features. They selected the Mentor Graphics HyperLynx technology, widely adopted at many PCB design sites, as their robust signal and power integrity solution. Fortunately, help is available for each of these problems. May 3rd, 2010, by Steve McKinney | Permalink · Share. HyperLynx PCB Analysis Blog: The HyperLynx team discusses Signal & Power Integrity issues in today's digital designs. Home> IC Design Design Center > How To Article Exactly how signal integrity engineers can combine traditional and behavioral black box models to trick-out their high-speed interfaces will be the subject of the DesignCon session, Modeling High-Speed Interconnects for the Signal Integrity Physical models usually simulate a high-speed interconnect with RLC circuit elements whose values can be adjusted to debug problems and to optimize performance. Signal Integrity Issues and Printed Circuit Board Design Douglas Brooks The definitive high-speed design resource for every PCB designer In this book, renowned. With 35 designers, we are one of the largest layout service providers in North America specializing in high-performance PCB design. Several things could go wrong - including pin assignments that don't work in the board layout, signal integrity problems on the board, and parasitic package inductance.